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VERTICAL DUAL 데이터시트, PDF

Agilent(Hewlett-Packard)(10)Fairchild Semiconductor(811)Fangtek Ltd.(4)FCI connector(43)Feature Integration Technology Inc.(1)Feeling Technology Corp.(8)FIDELIX(4)Filtran LTD(12)First Components International(13)Formosa MS(6)Fortune Semiconductor Corp.(5)FOSLINK SEMICONDUCTOR CO.,LTD(3)Freescale Semiconductor, Inc(85)Frequency Devices, Inc.(5)Frontier Electronics.(49)FSP TECHNOLOGY INC.(3)Fuji Electric(5)Fujitsu Component Limited.(50)Future Technology Devices International Ltd.(14)FutureWafer Tech Co.,Ltd(3)Gamewell-FCI by Honeywell(2)Gamma Microelectronics Inc.(6)GE Solid State(1)General Cable Technologies Corporation(1)General Semiconductor(5)GENESYS LOGIC(1)Gennum Corporation(11)Glenair, Inc.(34)Global Mixed-mode Technology Inc(31)Golledge Electronics Ltd(1)GOOD-ARK Electronics(63)GREATECS(1)Green Power Solutions srl(2)GSI Technology(85)GTM CORPORATION(13)GUANGDONG HOTTECH INDUSTRIAL CO.,LTD.(2)Guilin Strong Micro-Electronics Co., Ltd.(3)Hamamatsu Corporation(1)Hammond Manufacturing Ltd.(64)Harris Corporation(14)Harwin Plc(122)Hi-Sincerity Mocroelectronics(9)Hirose Electric(9)Hitachi Semiconductor(129)HITRON ELECTRONICS CORPORTION(26)Hittite Microwave Corporation(38)Holt Integrated Circuits(55)Holtek Semiconductor Inc(20)Honeywell Solid State Electronics Center(5)HTC Korea TAEJIN Technology Co.(6)HuaXinAn Electronics CO.,LTD(2)Hynix Semiconductor(9)IC MICROSYSTEMS(5)IC-Haus GmbH(8)IK Semicon Co., Ltd(54)IMP, Inc(5)Impala Linear Corporation(5)Inchange Semiconductor Company Limited(1)Infineon Technologies AG(99)Innovative Power Products, Inc.(51)Inolux Corporation(18)Integral Corp.(53)Integrated Circuit Systems(37)Integrated Device Technology(150)Integrated Silicon Solution, Inc(10)Integrated Technology Future(1)Intel Corporation(8)InterFET Corporation(19)International Rectifier(160)Interpion semiconductor(10)Interpoint Corporation Company(15)Intersil Corporation(774)Intronics Power, Inc.(7)IRC - a TT electronics Company.(2)Isahaya Electronics Corporation(3)ISOCOM COMPONENTS(1)ITT Industries(1)IXYS Corporation(107)JDS Uniphase Corporation(4)JFW Industries, Inc.(45)Jiangsu Changjiang Electronics Technology Co., Ltd(134)JL World Company Limited.(1)JMK Inc.(1)Johanson Technology Inc.(15)Quanzhou Jinmei Electronic Co.,Ltd.(32)Shenzhen hui lida electronic co., LTD(1)Shenzhen Jin Yu Semiconductor Co., Ltd.(36)
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검색 결과 : 'VERTICAL DUAL ' - 전체: 57647 (1/2883) Pages
제조업체부품명데이터시트부품 상세설명

Molex Electronics Ltd.
0901311108_17 2.54mm Pitch C-Grid III Header, Dual Row, Vertical, 56 Circuits, 0.10μm Gold (Au) 2.54mm Pitch C-Grid III Header, Dual Row, Vertical, 56 Circuits, 0.10μm Gold (Au)
0484090004 Universal Serial Bus (USB 3.0) I/O Receptacle, Dual Port Stacked, Vertical, Type A,Universal Serial Bus (USB 3.0) I/O Receptacle, Dual Port Stacked, Vertical, Type A,
0039299024 4.20mm (.165") Pitch Mini-Fit Jr.™ Header, Dual Row, Vertical, with Snap-in Plastic 4.20mm (.165") Pitch Mini-Fit Jr.™ Header, Dual Row, Vertical, with Snap-in Plastic Selective Plating, with Drain Holes
0702800449 2.54mm (.100") Pitch C-Grid Breakaway Header, Dual Row, Vertical, High 2.54mm (.100") Pitch C-Grid Breakaway Header, Dual Row, Vertical, High
0877615021 2.00mm (.079) Pitch Milli-Grid™ Header, Dual Row Dual Body, Through Hole, Vertical, 50 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, 8.70mm (.343) Stacking Height
0877615001 2.00mm (.079) Pitch Milli-Grid™ Header, Dual Row Dual Body, Through Hole, Vertical, 50 Circuits, 0.75μm (30μ) Gold (Au) Selective Plating, 10.30mm (.406) Stacking Height
0877612400 2.00mm (.079) Pitch Milli-Grid™ Header, Dual Row Dual Body, Through Hole, Vertical, 24 Circuits, 0.75μm (30μ) Gold (Au) Selective Plating
0877615022 2.00mm (.079) Pitch Milli-Grid™ Header, Dual Row Dual Body, Through Hole, Vertical, 50 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, 5.71mm (.225) Stacking Height

Major League Electronic...
LSMBC-2-DV .079 cl Dual Row - Vertical - Dual Entry Low Profile - Surface Mount Box Contact

Molex Electronics Ltd.
0877970602 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row Dual Body, Vertical, 6 Circuits, 0.76μm (30μ) Gold (Au) Plating, 25.60mm (1.043) Stacking Height
0877970040 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row Dual Body, Vertical, 40 Circuits, 2.54μm (100μ) Tin (Sn) Plating, 14.22mm (.560) Stacking Height
0877971200 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row Dual Body, Vertical, 12 Circuits, 0.76μm (30μ) Gold (Au) Plating, 8.00mm (.315) Stacking Height
0877970010 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row Dual Body, Vertical, 34 Circuits, Tin (Sn) Overall Plating, 15.10mm (.594) Stacking Height, Tray Packaging
0877971800 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row Dual Body, Vertical, 18 Circuits, Gold (Au) Flash Plating, 9.35mm (.368) Stacking Height, Tray Packaging
0877621633 2.00mm (.079) Pitch Milli-Grid™ Header, Dual Row Dual Body, Surface Mount, Vertical, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
0877612001 2.00mm (.079) Pitch Milli-Grid™ Header, Dual Row Dual Body, Through Hole, Vertical, 20 Circuits, 0.75μm (30μ) Gold (Au) Selective Plating
0877614408 2.00mm (.079) Pitch Milli-Grid™ Header, Dual Row Dual Body, Through Hole, Vertical, 44 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, 12.50mm (.492) Stacking
0039310207_18 Mini-Fit Jr. Vertical Header, 4.20mm Pitch, Dual Row, 20 Circuits, without Snap-in Plastic Peg PCB Lock, Gold, Natural
0430450212 3.00mm (.118") Pitch Micro-Fit 3.0™ Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 2 Circuits
0010897222 2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 22 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating

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