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PLATING 데이터시트, PDF

검색된 단어 : 'PLATING' - Total: 860 (6/43) Pages
제조업체부품명데이터시트상세설명
Company Logo Img
Molex Electronics Ltd.
0702474052 Datasheet pdf image
172Kb/4P
2.54mm (.100") Pitch C-Grid짰 Header, Dual Row, Low Profile, Right Angle, Shrouded40 Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702476052 Datasheet pdf image
172Kb/4P
2.54mm (.100") Pitch C-Grid짰 Header, Dual Row, Low Profile, Right Angle, Shrouded60 Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702474851 Datasheet pdf image
172Kb/4P
2.54mm (.100") Pitch C-Grid짰 Header, Dual Row, Low Profile, Right Angle, Shrouded48 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702471652 Datasheet pdf image
172Kb/4P
2.54mm (.100") Pitch C-Grid짰 Header, Dual Row, Low Profile, Right Angle, Shrouded16 Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702475052 Datasheet pdf image
172Kb/4P
2.54mm (.100") Pitch C-Grid짰 Header, Dual Row, Low Profile, Right Angle, Shrouded50 Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702474051 Datasheet pdf image
172Kb/4P
2.54mm (.100") Pitch C-Grid짰 Header, Dual Row, Low Profile, Right Angle, Shrouded40 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702475652 Datasheet pdf image
172Kb/4P
2.54mm (.100") Pitch C-Grid짰 Header, Dual Row, Low Profile, Right Angle, Shrouded56 Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702466402 Datasheet pdf image
187Kb/4P
2.54mm (.100") Pitch C-Grid짰 Header, Low Profile, Dual Row, Vertical, Shrouded, 64 Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702462001 Datasheet pdf image
187Kb/4P
2.54mm (.100") Pitch C-Grid짰 Header, Low Profile, Dual Row, Vertical, Shrouded, 20 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702473051 Datasheet pdf image
172Kb/4P
2.54mm (.100") Pitch C-Grid짰 Header, Dual Row, Low Profile, Right Angle, Shrouded30 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702471251 Datasheet pdf image
172Kb/4P
2.54mm (.100") Pitch C-Grid짰 Header, Dual Row, Low Profile, Right Angle, Shrouded12 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702472052 Datasheet pdf image
172Kb/4P
2.54mm (.100") Pitch C-Grid짰 Header, Dual Row, Low Profile, Right Angle, Shrouded20 Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702473052 Datasheet pdf image
172Kb/4P
2.54mm (.100") Pitch C-Grid짰 Header, Dual Row, Low Profile, Right Angle, Shrouded30 Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702472651 Datasheet pdf image
172Kb/4P
2.54mm (.100") Pitch C-Grid짰 Header, Dual Row, Low Profile, Right Angle, Shrouded26 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702472451 Datasheet pdf image
172Kb/4P
2.54mm (.100") Pitch C-Grid짰 Header, Dual Row, Low Profile, Right Angle, Shrouded24 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702476452 Datasheet pdf image
172Kb/4P
2.54mm (.100") Pitch C-Grid짰 Header, Dual Row, Low Profile, Right Angle, Shrouded64 Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702464002 Datasheet pdf image
187Kb/4P
2.54mm (.100") Pitch C-Grid짰 Header, Low Profile, Dual Row, Vertical, Shrouded, 40 Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702462002 Datasheet pdf image
187Kb/4P
2.54mm (.100") Pitch C-Grid짰 Header, Low Profile, Dual Row, Vertical, Shrouded, 20 Circuits, 0.76關m (30關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702474451 Datasheet pdf image
172Kb/4P
2.54mm (.100") Pitch C-Grid짰 Header, Dual Row, Low Profile, Right Angle, Shrouded44 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
0702476051 Datasheet pdf image
172Kb/4P
2.54mm (.100") Pitch C-Grid짰 Header, Dual Row, Low Profile, Right Angle, Shrouded,60 Circuits, 0.38關m (15關") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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PLATING 란


전자부품 Plating(도금)은 전자 부품 제조 과정에서 중요한 역할을 합니다.

도금은 전자 부품의 외관적인 면을 개선하거나, 전자적 성능을 향상시키는 데 사용됩니다.

예를 들어, 도금은 부식 방지 및 내구성 개선을 위해 사용됩니다.

또한, 전기 저항 및 전기 전도성을 개선하기 위해 도금도 사용됩니다.

이러한 도금은 전자 부품의 연결 핀, 패드, 케이스, 기타 부품에 적용될 수 있습니다.

전자 부품에서 사용되는 도금 종류에는 금, 은, 니켈, 구리 등이 있습니다.

이 중에서도 금 도금은 가장 많이 사용되며, 내식성과 전기적 성능이 우수하여 널리 사용됩니다.

전자 부품 도금의 종류와 적용 방법은 해당 부품의 용도, 소자 구성, 사용환경 등에 따라 다양합니다.

따라서 전자 부품 제조 과정에서는 적절한 도금 방법을 선택하여 최적의 성능과 내구성을 보장할 수 있도록 노력합니다.

*이 정보는 일반적인 정보 제공의 목적으로만 제공되며 위 정보로 인해 발생하는 손실이나 손해에 대해 책임을 지지 않습니다.


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