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PLATING 데이터시트, PDF

검색된 단어 : 'PLATING' - Total: 792 (11/40) Pages
제조업체부품명데이터시트상세설명
Company Logo Img
Molex Electronics Ltd.
0449140201 Datasheet pdf image
185Kb/3P
3.00mm (.118") Pitch Micro-Fit 3.0 CPI??Header, Compliant Pin Interface, Dual Row,Vertical, 2 Circuits, Tin (Sn) Plating, Glow Wire Compatible
0449142401 Datasheet pdf image
185Kb/3P
3.00mm (.118") Pitch Micro-Fit 3.0 CPI??Header, Compliant Pin Interface, Dual Row, Vertical, 24 Circuits, Tin (Sn) Plating, Glow Wire Compatible
0458301023 Datasheet pdf image
503Kb/4P
1.20mm (.047") by 2.00mm (.079") Pitch HD Mezz??Plug, 299 Circuits, 18.00mm (.708") Unmated Height, 23 Rows, Tin (Sn)/Lead (Pb) Plating
0476621000 Datasheet pdf image
288Kb/5P
1.27mm (.050") Pitch Removable Interposer for Dual-Piece Slimline Serial ATA Connector Assembly, Right Angle, Through Hole, Gold (Au) Flash Plating, Leadfree
0481912000 Datasheet pdf image
385Kb/4P
0.80mm (.031") Pitch Edge Card Connector, Vertical, SMT, 80 Circuits, 0.38關m (15關") Gold (Au) Plating, with Pegs, Lead Free
0459854912 Datasheet pdf image
342Kb/7P
12.00mm (.472") Pitch, EXTreme LPHPower??Header, Right Angle, 4 Power Contacts, Select Gold (Au) Plating, for 3.18mm (.125") Thick PC Board, with Guide
0459854373 Datasheet pdf image
444Kb/7P
1.27mm (.050"), 12.00mm (.472") Pitch, EXTreme LPHPower??Header, Right Angle, 4Power Contacts, 36 Signal Contacts, Select Gold (Au) Plating, for 1.57mm (.062") Thick
0459841933 Datasheet pdf image
360Kb/7P
EXTreme LPHPower??Receptacle Header, Right Angle, 10 Power Contacts, SelectGold (Au) Plating, for 1.57mm (.062") Thick PC Board with Press-fit Plastic Pegs
0444321801 Datasheet pdf image
235Kb/5P
3.00mm (.118") Pitch Micro-Fit 3.0 BMI??Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 18 Circuits, Tin (Sn) Plating
0459850383 Datasheet pdf image
427Kb/7P
1.27mm (.050") Pitch, EXTreme LPHPower??Plug with Pegs, Right Angle, 40 Signal Contacts, Select Gold (Au) Plating, for 1.57mm (.061") Thick PC Board
0459858462 Datasheet pdf image
491Kb/7P
1.27mm (.050"), 12.00mm (.472") Pitch, EXTreme LPHPower??Header, Right Angle, 8Power Contacts, 32 Signal Contacts, Select Gold (Au) Plating, for 2.36mm (.093") Thick
0459851341 Datasheet pdf image
492Kb/7P
1.27mm (.050"), 12.00mm (.472") Pitch, EXTreme LPHPower??Header, Right Angle,10 Power Contacts, 24 Signal Contacts, Select Gold (Au) Plating, for 3.18mm (.125")
0459856361 Datasheet pdf image
471Kb/7P
1.27mm (.050"), 12.00mm (.472") Pitch, EXTreme LPHPower??Header, Right Angle, 6Power Contacts, 32 Signal Contacts, Select Gold (Au) Plating, for 3.18mm (.125") Thick
0460075306 Datasheet pdf image
397Kb/5P
7.50mm (.295") Pitch Sabre??Header, Single Row, Right Angle, 6 Circuits, PC TailLength 5.33mm (.210"), with Snap-In Metal Pins, Tin (Sn) Plating
0444321201 Datasheet pdf image
235Kb/5P
3.00mm (.118") Pitch Micro-Fit 3.0 BMI??Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 12 Circuits, Tin (Sn) Plating
0459854342 Datasheet pdf image
444Kb/7P
1.27mm (.050"), 12.00mm (.472") Pitch, EXTreme LPHPower??Header, Right Angle, 4Power Contacts, 24 Signal Contacts, Select Gold (Au) Plating, for 2.36mm (.093") Thick
0459856141 Datasheet pdf image
471Kb/7P
1.27mm (.050"), 12.00mm (.472") Pitch, EXTreme LPHPower??Header, Right Angle, 6Power Contacts, 24 Signal Contacts, Select Gold (Au) Plating, for 3.18mm (.125") Thick
0476572000 Datasheet pdf image
198Kb/4P
1.27mm (.050") Pitch Removable Slimline Serial ATA Plug for Optical DiskDrive, Vertical, Bottom Mount, SMT, Gold (Au) Flash Plating, with Cap, Lead-free
0444321401 Datasheet pdf image
235Kb/5P
3.00mm (.118") Pitch Micro-Fit 3.0 BMI??Header, Surface Mount Compatible, Dual Row, Vertical, with PCB Polarizing Peg, 14 Circuits, Tin (Sn) Plating
0459851932 Datasheet pdf image
342Kb/7P
12.00mm (0.472") Pitch, EXTreme LPHPower??Header, Right Angle, 10 Power Contacts, Select Gold (Au) Plating, for 1.57mm (.062") Thick PC Board with Guide

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PLATING 란


전자부품 Plating(도금)은 전자 부품 제조 과정에서 중요한 역할을 합니다.

도금은 전자 부품의 외관적인 면을 개선하거나, 전자적 성능을 향상시키는 데 사용됩니다.

예를 들어, 도금은 부식 방지 및 내구성 개선을 위해 사용됩니다.

또한, 전기 저항 및 전기 전도성을 개선하기 위해 도금도 사용됩니다.

이러한 도금은 전자 부품의 연결 핀, 패드, 케이스, 기타 부품에 적용될 수 있습니다.

전자 부품에서 사용되는 도금 종류에는 금, 은, 니켈, 구리 등이 있습니다.

이 중에서도 금 도금은 가장 많이 사용되며, 내식성과 전기적 성능이 우수하여 널리 사용됩니다.

전자 부품 도금의 종류와 적용 방법은 해당 부품의 용도, 소자 구성, 사용환경 등에 따라 다양합니다.

따라서 전자 부품 제조 과정에서는 적절한 도금 방법을 선택하여 최적의 성능과 내구성을 보장할 수 있도록 노력합니다.

*이 정보는 일반적인 정보 제공의 목적으로만 제공되며 위 정보로 인해 발생하는 손실이나 손해에 대해 책임을 지지 않습니다.


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