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PACKAGING 데이터시트, PDF

검색 결과 : 'PACKAGING' - 전체: 1093 (1/55) Pages
제조업체부품명데이터시트부품 상세설명

Molex Electronics Ltd.
0528306642 Modular Jack, Right Angle, 6/6 Circuits, 1.3μm (50μ ") Gold (Au) Selective Plating, withBeveled Metal Pins, Tray Packaging, Lead-free
0527462071 0.50mm Pitch FFC/FPC Connector, Right Angle, SMT, ZIF, Bottom ContactStyle, 20 Circuits, Lead-free, Gold Contact Plating, High Barrier Packaging
0479890312 1.00mm by 1.00mm Pitch rPGA 988B Notebook PC CPU Socket,with Mylar, Hard Tray Packaging

MORNSUN Science& Techno...
URA2405YMD-20WR3 20W, Ultra wide input isolated & regulated dual output , DIP packaging, DC-DC converter

Taiyo Yuden (U.S.A.), I...
TMK042CG1R1AD-W Standard packaging quantity
TMK021CG070CK-W Standard packaging quantity

Texas Instruments
TPS77101_16 150-mA LDO REGULATORS WITH 8-PIN MSOP PACKAGING

Torex Semiconductor
MSOP-8A Packaging Information / Reference Pattern Layout Dimensions

Johanson Technology Inc...
L-14C4N7SV4T Chip and Wirewound Inductor Packaging Information Taping Specifications

Molex Electronics Ltd.
0878910106 2.54mm (.100) Pitch KK® Header, Through Hole, Vertical, 1 Circuit, 2.50 μm (100μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
0879141001 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 10 Circuits, 0.38μm (15μ) Gold (Au) Plating, Tray Packaging, Lead-free
0879114212 2.54mm (.100) Pitch C-Grid® Header, Right Angle, Through Hole, 42 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
0877584850 2.00mm (.079) Pitch Milli-Grid™ Header, Through Hole, Vertical, 48 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free
0536271074 0.635mm Pitch SlimStack™ Header, Surface Mount, Dual Row, VerticalStacking, 10.00 and 16.00mm (.394 and Stacking Heights, Lead-free, 100Circuits, with Embossed Tape with Cover Packaging
0526101372 1.00mm Pitch FFC/FPC Connector, SMT, Vertical, ZIF, Gold (Au) ContactPlating, 13 Circuits, Lead-free, High Barrier Packaging
0529010274 0.635mm Pitch SlimStack™ Receptacle, Surface Mount, Dual Row, VerticalStacking, 11.00 to 16.00mm (.433 to Stacking Heights, Embossed Tape withCover Packaging, 20 Circuits, Lead-free
0522072060 1.00mm Pitch FFC/FPC Connector, SMT, Right Angle, ZIF, Top Contact StyleReceptacle, 20 Circuits, Lead-free, Gold Contact Plating, High Barrier Packaging
0479890112 1.00mm by 1.00mm Pitch rPGA 989 Notebook PC CPU Socket, with Mylar, Hard Tray Packaging, 989 Circuits, Lead free
0874272242_18 Mini-Fit Jr. Header, 4.20mm Pitch, Vertical, Nylon, without Flange, 22Circuits, Tin (Sn)over Nickel (Ni) Plating, Bulk Packaging

Taiyo Yuden (U.S.A.), I...
TMK042CG0R6CD-W Standard packaging quantity

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