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PACKAGING 데이터시트, PDF

검색 결과 : 'PACKAGING' - 전체: 230 (1/12) Pages
제조업체부품명데이터시트부품 상세설명

Molex Electronics Ltd.
0878911818 2.54mm (.100) Pitch KK® Header, Through Hole, Breakaway, Vertical, 18 Circuits, 0.38μm (15μ) Gold (Au) Plating, with Cap, Tape on Reel Packaging, Lead-free
0879114011 2.54mm (.100) Pitch C-Grid® Header, Right Angle, Through Hole, 40 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
0903259008 1.27mm (.050) Pitch Picoflex® PF-50 Header, Vertical, Low Profile, 8 Circuits, Tin (Sn) Plating, Tube Packaging
0879140009 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 6 Circuits, Gold (Au) Flash Overall Plating, Tray Packaging, Lead-free
0878712213 1.25mm (.049) Pitch Board-to-Board Receptacle, Through Hole, Friction Lock, with Kinked PC Tails, 13 Circuits, Tin (Sn) Overall, Tube Packaging, Lead-free
0878980626 2.54mm (.100) Pitch KK® Header, Surface Mount, Breakaway, Vertical, 6 Circuits, Tin (Sn) Overall Plating, Tube Packaging, without Cap, Lead- free
0878982426 2.54mm (.100) Pitch KK® Header, Surface Mount, Breakaway, Vertical, 24 Circuits, Tin (Sn) Overall Plating, Tube Packaging, without Cap, Lead- free
0878721117 1.25mm (.049) Pitch Board-to-Board Header, Through Hole, Friction Lock, with Kinked PC Tails, 17 Circuits, Tin (Sn) Overall, Tube Packaging, Lead-free
0879143416 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 34 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
0878910204 2.54mm (.100) Pitch KK® Header, Through Hole, Breakaway, Vertical, 2 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free
0879117011 2.54mm (.100) Pitch C-Grid® Header, Right Angle, Through Hole, 70 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
0878304021 2.00mm (.079) Pitch Milli-Grid™ Straddle Mount Header, 40 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free
0878910106 2.54mm (.100) Pitch KK® Header, Through Hole, Vertical, 1 Circuit, 2.50 μm (100μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
0879141001 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 10 Circuits, 0.38μm (15μ) Gold (Au) Plating, Tray Packaging, Lead-free
0879114212 2.54mm (.100) Pitch C-Grid® Header, Right Angle, Through Hole, 42 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
0879113811 2.54mm (.100) Pitch C-Grid® Header, Right Angle, Through Hole, 38 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
0879142815 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75μm (30μ) Gold (Au) Plating, Tray Packaging, Lead-free
0878980554 2.54mm (.100) Pitch KK® Header, Surface Mount, Breakaway, Vertical, 5 Circuits, 0.38μm (15μ) Gold (Au) Plating, Tape on Reel Packaging, with Cap, Lead-free
0878980426 2.54mm (.100) Pitch KK® Header, Surface Mount, Breakaway, Vertical, 4 Circuits, Tin (Sn) Overall Plating, Tube Packaging, without Cap, Lead- free
0879117611 2.54mm (.100) Pitch C-Grid® Header, Right Angle, Through Hole, 76 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free

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