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PACKAGING 데이터시트, PDF

검색 결과 : 'PACKAGING' - 전체: 1093 (1/55) Pages
제조업체부품명데이터시트부품 상세설명

Taiyo Yuden (U.S.A.), I...
EMK042CG6R6BD-W Standard packaging quantity

Rohm
AH2002-DC50A For Packaging High-speed Printers A H Series

Diodes Incorporated
ZXRE060_V1 Space saving packaging for ZXRE060 0.6V shunt regulator

MORNSUN Science& Techno...
LS01-15B15S LS01 Series ----- are high efficiency green power modules with miniature packaging provided by Mornsun.

Molex Electronics Ltd.
0903257018 1.27mm (.050) Pitch Picoflex® PF-50 Header, Vertical, Low Profile, with PCB Pegs, 18 Circuits, Tube Packaging
0879432101 2.50mm (.098) / 3.50mm (.138) Pitch Wire-to-Board Female Crimp Terminal, Tin (Sn) Overall, 20 AWG, Reel Packaging, Lead-free
0879143435 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 34 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free
0877580617 2.00mm (.079") Pitch Milli-Grid™ Header, Through Hole, Vertical, 6 Circuits, 0.76μm(30μ") Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
0529010774 0.635mm (.025") Pitch SlimStack™ Receptacle, Surface Mount, Dual Row, VerticalStacking, 11.00 to 16.00mm (.433 to .630") Stacking Heights, Embossed Tape withCover Packaging, 70 Circuits, Lead-free
0525592452 0.50mm (.020") Pitch FFC/FPC Connector, Vertical, SMT, ZIF, 24 Circuits, Lead-freeGold Contact Plating, High Barrier Packaging
0522711379 1.00mm (.039") Pitch FFC/FPC Connector, Right Angle, SMT, ZIF, Bottom ContactStyle, 13 Circuits, Lead-free, High Barrier Packaging
0671300806 1.27mm (.050") Card Bus Header: One Slot, Flush Profile, Top Mount, Right AngleSMT, with Mylar, Embossed Tape on Reel Packaging, Lead-free

Fairchild Semiconductor
FAN5350_08 3MHz, 600mA Step-Down DC-DC Converter in Chip-Scale and MLP Packaging

Micross Components
ASJE1700R550 Hermetic TO-258 Packaging

Taiyo Yuden (U.S.A.), I...
HMK105B7152KV-F Standard packaging quantity
EMK042CG6R2BD-W Standard packaging quantity
FL05R100A Standard packaging quantity (minimum)

Vishay Siliconix
US1M-E35AT Packaging Information

Wurth Elektronik GmbH &...
6871XX14022 0.5MM ZIF FPC HORIZONTAL TOP CONTACT TYPE - TAPE & REEL PACKAGING

Molex Electronics Ltd.
0879140616 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, 6 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

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