PACKAGE Datasheet(PDF) - S6015L52 - Littelfuse

전자부품 데이터시트 검색엔진

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PACKAGE 데이터시트, PDF

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검색된 단어 : 'PACKAGE' - Total: 22 (1/2) Pages

제조업체	부품명	데이터시트	상세설명
Littelfuse	S6015L52	218Kb/12P	Electrically-isolated package
	P0080SA	97Kb/1P	DO-214AA Package Symbolization
	S-2025L	218Kb/12P	RoHS Compliant, Electrically-isolated package
	HE3600	402Kb/3P	Miniature single in-line package
	HE3300	436Kb/3P	Miniature single in-line package
	HE700	590Kb/3P	Miniature dual in-line package
	P0080SAL	843Kb/52P	gas plasma arresters-package dimensions/specifications
	S2012DRP	218Kb/12P	New small profile three-leaded Compak package
	NGD18N45CLB	279Kb/8P	DPAK Package Offers Smaller Footprint for Increased Board Space
	SP0504BAC	352Kb/6P	TVS Avalanche Diode Array in a Unipolar Chip Scale Package
	SP0504BBCT	172Kb/3P	SP0504BBCT - TVS Avalanche Diode Array in a Bipolar Chip Scale Package
	SP0501BACT	186Kb/3P	TVS Diode Arrays - TVS Avalanche Diode in a Chip Scale Package
	SP0502AAHT	199Kb/4P	Silicon Protection Circuits - TVS Rail Clamp Array in a Surface Mount Package
	SP0504BACT	157Kb/3P	Silicon Protection Circuits - TVS Avalanche Diode Array in a Unipolar Chip Scale Package
	P1100THLRP	448Kb/4P	This DO-41 plastic package provides a through-hole version of the SIDACtor짰 devices.
	P1500MEL	134Kb/4P	Packaged in a robust TO-218 package, the 5kA Series is ideal for use in CATV amplifiers
	FPS	2Mb/2P	The FPS Feeder Protection System monitors voltage and current to provide a comprehensive package of 17 protective functions
	0460001ER	333Kb/3P	The 460 Series Slo-Blo짰 SMF is based on Littelfuse PICO짰 fuse through-hole technology, though offered in a surface mount package.
	TPSMF4L	2Mb/6P	The TPSMF4L series of SOD-123FL small and flat lead low-profile plastic package is designed specifically to protect sensitive electronic equipment from voltage
	SM7	780Kb/5P	The Littelfuse SM7 is a plastic-encapsulated surface mount MOV in a PPS material molded package with tin-plated terminal which is fully qualified in lead free

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PACKAGE 란

전자부품에서 PACKAGE는 소자를 보호하고 연결하는데 사용되는 케이스 또는 패키지를 의미합니다.

PACKAGE는 소자를 보호하고 연결하는데 중요한 역할을 합니다.

소자를 적절히 보호하지 않으면 환경적인 영향으로 소자가 손상되거나 파괴될 수 있습니다.

PACKAGE는 다양한 형태와 크기가 있으며, 소자의 종류와 용도에 따라 다양한 종류가 있습니다.

대표적인 PACKAGE로는 DIP (Dual in-line package), SOP (Small-outline package), QFP (Quad flat package), BGA (Ball grid array) 등이 있습니다.

DIP는 대표적인 패키지 중 하나로, 인라인으로 배치된 두 개의 핀을 가지고 있습니다.

SOP는 DIP보다 더 작은 크기의 패키지로, 직사각형 모양을 가지고 있습니다.

QFP는 핀이 패키지의 둘레에 평행하게 나열된 패키지이며, BGA는 소자의 바닥에 작은 구멍을 뚫고 그 안에 작은 구슬을 달아 소자를 연결하는 패키지입니다.

각 패키지의 특징에 따라 다양한 용도에 사용됩니다.

예를 들어, DIP는 일반적으로 낮은 밀도의 집적 회로에 사용되고, BGA는 고밀도의 집적 회로에 사용됩니다.

*이 정보는 일반적인 정보 제공의 목적으로만 제공되며 위 정보로 인해 발생하는 손실이나 손해에 대해 책임을 지지 않습니다.

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