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PITCH 데이터시트, PDF

ALL 3M Electronics(5)Actel Corporation(4)Adam Technologies, Inc.(74)Advanced Thermal Solutions, Inc.(16063)Advanced Thermal Solutions, Inc.(21515)ALPS ELECTRIC CO.,LTD.(1)American Electronic Components, inc(1)AMI SEMICONDUCTOR(5)Amphenol Corporation(5)Analog Microelectronics(26)Apacer Technology Inc.(2)Aries Electronics, Inc.(13)Assmann Electronics Inc.(40)AVAGO TECHNOLOGIES LIMITED(24)AVX Corporation(36)AZ Displays(1)Bi technologies(1)Bourns Electronic Solutions(1)Broadcom Corporation.(5)C&K Components(3)Copal Electronics(6)COSMO Electronics Corporation(1)CT Micro International Corporation(4)CTS Corporation(7)DB Lectro Inc(14)DDK Ltd.(11)Dialog Semiconductor(1)Diotec Semiconductor(2)Dubilier(46)E-SWITCH(1)ERNI Electronics(6)Everlight Electronics Co., Ltd(1)
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검색된 단어 : 'PITCH' - Total: 85804 (1/4291) Pages
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148Kb/9P		 Optimum accommodation of electronic components with graded PITCHes with a design width of 22.5 mm, 45 mm, 67.5 mm, and 90 mm

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PITCH 란

전자부품에서 pitch는 핀 간격을 나타내는 용어입니다.

핀은 전자부품이 회로에 연결되는 부분을 말하며, pitch는 이러한 핀들 간의 간격을 의미합니다.

보통 핀 간격은 밀리미터(mm) 단위로 표시되며, 작은 핀 간격은 전자부품을 더 작은 크기로 만들 수 있게 하므로, 최근에는 더 작은 pitch를 가진 부품들이 많이 개발되고 있습니다.

예를 들어, 일반적으로 사용되는 DIP(Dual In-line Package) IC 부품의 핀 간격은 2.54mm(0.1인치)이지만, 최근에는 BGA(Ball Grid Array)나 QFN(Quad Flat No-leads) 등의 고밀도 부품에서는 핀 간격이 0.4mm, 0.3mm, 0.2mm, 0.15mm 등으로 극도로 작아진 경우도 있습니다.

핀 간격이 작아지면 회로가 더 밀집되어 더 작은 크기의 전자 제품을 만들 수 있게 됩니다.

하지만, 핀 간격이 작아질수록 제작과 배선이 어려워질 수 있으며, 열 분산이 불균형하게 될 수도 있어서 열 문제가 발생할 수 있습니다.

*이 정보는 일반적인 정보 제공의 목적으로만 제공되며 위 정보로 인해 발생하는 손실이나 손해에 대해 책임을 지지 않습니다.


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